?The 3G-SDI 1 by 4 Splitter allows SD-SDI, HD-SDI and 3G-SDI signals to be split from a single SDI source to up four simultaneous SDI outputs while ensuring high bit rates of 2.970 Gbit/s to give you high bandwidth signal transmission without signal loss over long distances.
- SplitS one 3G-SDI input source to four 3G-SDI displays simultaneously
- Operation at 2.970Gb/s, 2.970/1.001Gb/s, 1.485Gb/s, 1.485/1.001Gb/s and 270Mb/s
- Supports SMPTE 425M-A, SMPTE 424M, SMPTE 292M, SMPTE 259M-C
- Provides equalized and re-clocked transmission
- Supports signal input and output distances of up to 300m for SD-SDI signals, 200m for HD-SDI signals and 100m for 3G-SDI signals
SMPTE Standard | 425M Level A & B, 424M, 292M, 259M-C |
SDI Transmission Rates | 2.970 Gbit/s and 2.970/1.001 Gbit/s |
Input | 1×BNC (SD/HD/3G-SDI) |
Output | 4×BNC (SD/HD/3G-SDI) |
SDI Timing Support | SD-SDI: SMPTE 259M-C, 270 Mbit/s HD-SDI: SMPTE 292M, 1.485 & 1.485/1.001 Gbit/s 3G-SDI: SMPTE 424M/425M-AB, 2.970 & 2.970/1.001 Gbit/s |
Power Supply | 5 V DC/ 2.6 A (US/EU standards, CE/FCC/UL certified) |
ESD Protection | Human body model: ±8 kV (air-gap discharge) ±4 kV (contact discharge) |
SDI Cable Distance | 3G-SDI up to 100 m (BELDEN 1694A) HD-SDI up to 200 m (BELDEN 1694A) SD-SDI up to 300 m (BELDEN 1694A) |
Dimensions | 200 mm (W)×138 mm(D) x 30 mm (H) |
Weight | 900 g |
Chassis Material | Metal |
Silkscreen Color | Black |
Operating Temperature | 0 ?C~40 ?C/32 ?F~104 ?F |
Storage Temperature | ?20 ?C~60 ?C/?4 ?F~140 ?F |
Relative Humidity | 20~90 % RH (Non-condensing) |
Power Consumption | 5 W |